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The

lead free solder pastes SOLDER CHEMISTRY BLF

are high tech products designed for the new generation of SMD technology. Many years of experience in the SMT field and well-funded knowledge in polymers chemistry were part of a complete development for the future.
These SMT solder pastes are a homogeneous mixture of solder powder, in all required alloys and grain sizes, and an organic flux based on synthetic rosin.

Lead free solder pastes


Product

Specific feature
Solder paste SOLDER CHEMISTRY BLF082
Type ISO 1.2.3.C
lead free

New!
The solder paste SOLDER CHEMISTRY BLF 082 is a the latest development regarding all so called lead free SMT-Applications and the desire of customers for an easy printable and prolonged tackiness of the paste, to be able to bridge the rest period between printing and assembly, which can be up to several days.
At the same time our ""trade mark"" i.e. minimal residues on the PCB, which stay close to the solder joint after soldering, were to be retained. The use of the newest types of modified plastics and rheological additives in the solder paste and thus the resulting very good possibility to combine it with lead free alloys, as well as the latest discoveries and experience with lead free soldering have contributed to this development. Of course the careful and severe consideration of the norms DIN, EN, IPC and MIL are part of this product, too.

The BLF 082 is a homogenous mixture of a lead free solder powder, available in all required alloys and grain sizes, with an organic flux based on synthetic rosin, according to class RE L0 of J-STD-005 or RMA-qualifying.. Besides the usual advantages like an outstanding slump, no making of solder balls or splashes, as well as a high temperature stability, along with a long term processing time and long standing time, these advantages distinguish this paste:
  • Excellent resistance against humidity. Stickiness for days!!!
  • Forms very homogenous and pipe free solder joints!
  • Solders without problems, even on slightly corroded surfaces. (QFN forms!)
  • Residues are absolutely halide free. (correspond to the RE L0 classification!)
  • An outstanding printing quality, for hours, as already known!
  • Does, of course, not leave any tar residues in your reflow system.
  • Minimum, nearly invisible residues, as well as nearly no solderballing!





Product

Specific feature
Solder paste SOLDER CHEMISTRY BLF01
ISO 1.2.3.C; J-STD-004 RE L0
lead free
The solder paste SC BLF01 distinguishes itself through an excellent slump not only at room temperature, but also in the pre-heat phase, and therefore has excellent qualifications for Fine Pitch - applications.
Absolutely halogen free does not mean the SC BLF01 is it not only after the reflow, but already free of all halogens in the solder paste.
Solder paste SOLDER CHEMISTRY BLF02
Type ISO 1.2.2.C ; J-STD-004 RE L1
lead free
The solder paste SOLDER CHEMISTRY BLF 02 is a high tech product, which is very well applicable in all so called lead free SMT applications. It distinguish itself with outstanding slump, no making of solder balls or splashes, a long term processing time and long standing time, as well as a high temperature stability.
Solder paste SOLDER CHEMISTRY BLF03
Type ISO 1.2.3.C RE L0
lead free
The SC BLF03 is a cosequently evolved High-Tech-Product, which is best suitable for all lead-free SMT applications. The SC BLF03 is a homogenous mixture of a lead-free solder powder available in all required alloys and grain sizes, with an organic flux based on synthetic resin corresponding to RE L0 according to J-STD 004 (F-SW32) (exceeds the expectations of RMA!). Thus it belongs to the latest "no-clean" solder paste types.
Solder paste SOLDER CHEMISTRY BLF04
Type ISO 1.2.2.C ; J-STD-004 RE L1
lead free

The solder paste SOLDER CHEMISTRY BLF 04 our latest product, was developed especially for all so called lead free SMT applications. Though thanks to the application of modern chemical substances like plastics and resins, activator systems etc. all our pastes till now are able to be combined together with lead free alloys, the latest perceptions in "lead free soldering" have cotributed to this new development. Of course the careful and severe consideration of the norms DIN, EN, IPC and MIL are part of this product, too.
Solder paste SOLDER CHEMISTRY BLF05
Type ISO 1.2.3.C RE L0
lead free
The solder paste SOLDER CHEMISTRY SC BLF05 is one of the latest, promising creations specifically suitable for soldering in vapor phase and under inert gas. Not only many years of experience in the SMT field and a lasting cooperation with users of vapor phase ovens, but also the careful and strict consideration of ISO-, EN-, IPC-,and MIL- standards were part of a complete development for the future. SC BLF05 is a homogeneous mixture of solder powder, in all required alloys and grain sizes, and an organic flux based on synthetic rosin, corresponding to RE L0 according to J-STD-004, being thus one of the very best "vapor phase" solder pastes.
Solder paste SOLDER CHEMISTRY BLF06
Water Soluble, Type ISO 1.2.3.C RE L0
lead free
The solder paste SOLDER CHEMISTRY SC BLF06 was already in devolopement pointed onto lead free applications, what distinguishes this high-tech SMT-product. The flux is, too, before well as after the soldering very easy removeable. Its development is founded on the high demands of customers on the field of hybrid circuits and the SMT especially in the areaof HF, as well as the strict and severe consideration of ISO-, EN-, IPC- and MIL-norms. The SC BLF06 is a homogenous mixture of solder powder, available in all requiered alloys and grain sizes, with an organic flux based on watersoluable rosin according to class RE L0 according to J-STD-004. It is halide-free and belongs to the best water washable solder paste types.
Solder paste SOLDER CHEMISTRY BLF08
Type ISO 1.2.2.C
lead free

The solder paste SOLDER CHEMISTRY BLF 08 is a further development regarding all so called lead free SMT-Applications and the desire of customers for an easy printable and longer tacky paste. Especially the use of modified plastics, resins and activators systems etc. in our solder pastes until now and thus the resulting very good possibility to combine it with lead free alloys, as well as the latest discoveries and experience with lead free soldering have contributed to this development. Of course the careful and severe consideration of the norms DIN, EN, IPC and MIL are part of this product, too.
The BLF 08 is a homogenous mixture of a lead free solder powder, available in all required alloys and grain sizes, with an organic flux based on synthetic rosin, according to class RE L0 of J-STD-005 or RMA-qualifying.
Solder paste SOLDER CHEMISTRY BLF081
Type ISO 1.2.2.C
lead free

The solder paste SOLDER CHEMISTRY BLF 081 is a further development regarding all so called lead free SMT-Applications and the desire of customers for an easy printable and longer tacky paste, to be able to bridge the rest period between printing and assembly. At the same time our "trade mark" i.e. minimal residues on the PCB, which stay close to the solder joint after soldering, were to be retained. The use of the newest types of modified plastics and rheological additives in the solder paste and thus the resulting very good possibility to combine it with lead free alloys, as well as the latest discoveries and experience with lead free soldering have contributed to this development. Of course the careful and severe consideration of the norms DIN, EN, IPC and MIL are part of this product, too. The BLF 081 is a homogenous mixture of a lead free solder powder, available in all required alloys and grain sizes, with an organic flux based on synthetic rosin, according to class RE L0 of J-STD-005 or RMA-qualifying..



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Solder Chemistry, Hauptstraße 22, D-84061 Ergoldsbach, Germany
Tel. +49 (0) 8771 / 1039, Fax +49 (0) 8771 / 3814, www.solderchemistry.de