Based on our classic range, these pastes are the leading edge product for the lead-free age.
Solder paste SOLDER CHEMISTRY BLF01
TYPE ISO 1.2.3.C; J-STD-004 RE LO
Guaranteed no solder or side balls. The ultimate solution for pin-in-paste processes without solder or flux splatter.
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Solder paste SOLDER CHEMISTRY BLF02
TYPE ISO 1.2.2.C
The lead free paste for excellent results on Ag-, AgPd-, Cu and brass surfaces.
Solder paste SOLDER CHEMISTRY BLF03
TYPE ISO 1.2.3.C
No clean and 100% halogen free. The residues protect the printed circuit board as good as conformal coating.
Solder paste SOLDER CHEMISTRY BLF04
TYPE ISO 1.2.2.C; J-STD-004 RE LO
Very good no clean solder paste. Highly appreciated in Automotive due to low residues with extremely high SIR values and void-free solder joints.
Solder paste SOLDER CHEMISTRY BLF041
Type ISO 1.2.3.C; J-STD-004 RE L0
The evolution of BLF04 for excellent, absolutely void-free solder joints with water-clear residues, which can be easily removed, if necessary.
Solder paste SOLDER CHEMISTRY BLF05
Leaves almost no and barely noticeable residues and makes bonding near the soldering joint possible. Absolutely no solder or flux splatter.
Solder paste SOLDER CHEMISTRY BLF061
Water Soluble, TYPE ISO 1.2.3.C
SC BLF061 is our water-soluble lead-free paste.
Solder paste SOLDER CHEMISTRY BLF08
Guaranteed void-free solder joints.
Solder paste SOLDER CHEMISTRY BLF081
The universal solution in lead-free soldering.
Solder paste SOLDER CHEMISTRY BLF083
Our top product. Designed for excellent soldering results under all conceivable conditions. No voids, no solder balls and an extremely long bonding time.
